Wafer level packaging

Details Wafer level packaging Wafer level packaging

2006-02-14

2006-02-14

Thomas, Tom (Department: 2815)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S124000, C438S127000

Reexamination Certificate

active

06998297

ABSTRACT:
An integrated circuit package (50) may include an integrated circuit chip (22) having an integrated circuit (14). A lead frame (28) may be opposite the integrated circuit chip (22). The lead frame (28) may include at least one lead (30) electrically coupled to the integrated circuit (14) by a connector (42). The lead (30) may be within a periphery (32) of the integrated circuit chip (22). An encapsulant (44) may cover the integrated circuit (14), the connector (42) and a portion of the lead frame (28). A remaining portion of the lead frame (28) may be exposed from the encapsulant (44).

REFERENCES:
patent: 4695870 (1987-09-01), Patraw
patent: 5148266 (1992-09-01), Khandros et al.
patent: 5166866 (1992-11-01), Kim et al.
patent: 5384155 (1995-01-01), Abbott et al.
patent: 5519251 (1996-05-01), Sato et al.
patent: 5685885 (1997-11-01), Khandros et al.
patent: 5763829 (1998-06-01), Tomita et al.
patent: 5798286 (1998-08-01), Faraci et al.
patent: 5801439 (1998-09-01), Fujisawa et al.
patent: 5827999 (1998-10-01), McMillan et al.
patent: 5834691 (1998-11-01), Aoki
patent: 5907785 (1999-05-01), Palagonia
patent: 5959354 (1999-09-01), Smith et al.
patent: 6204455 (2001-03-01), Gilleo et al.
patent: 4238646 (1993-06-01), None
patent: 08045900 (1996-02-01), None

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