Wafer level package with cavities for active devices

Details Wafer level package with cavities for active devices Wafer level package with cavities for active devices

2007-05-05

2009-12-22

Zameke, David A (Department: 2891)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Responsive to electromagnetic radiation

C257SE23022

Reexamination Certificate

active

07635606

ABSTRACT:
According to one exemplary embodiment, a method for forming a wafer level package includes fabricating an active device on a substrate in a semiconductor wafer, forming polymer walls around the active device, and applying a blanket film over the semiconductor wafer and the polymer walls to house the active device in a substantially enclosed cavity formed by the polymer walls and the blanket film. By way of examples and without limitation, the active device can be a microelectromechanical systems (“MEMS”) device, a bulk acoustic wave (“BAW”) filter, or a surface acoustic wave (“SAW”) filter. According to one embodiment, solder bumps can be applied to interconnect traces of the active device, and the semiconductor wafer can then be diced to form an individual die. According to another embodiment, the semiconductor wafer can be diced to form an individual die, then the individual die is wire bonded to a circuit board.

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