Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2007-08-14
2007-08-14
Graybill, David E. (Department: 2822)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S125000, C438S611000, C438S613000, C438S615000, C438S667000, C438S680000, C438S763000, C438S780000
Reexamination Certificate
active
09832160
ABSTRACT:
A carrier for use in a chip-scale package, including a polymeric film with apertures defined therethrough. The apertures, which are alignable with corresponding bond pads of a semiconductor device, each include a quantity of conductive material extending substantially through the length thereof. The carrier may also include laterally extending conductive traces in contact with or otherwise in electrical communication with the conductive material in the apertures of the carrier. Contacts may be disposed on a backside surface of the carrier. The contacts may communicate with the conductive material disposed in the apertures of the carrier. A conductive bump, such as a solder bump, may be disposed adjacent each or any of the contacts. A chip-scale package including the carrier of the present invention is also within the scope of the present invention. Such a chip-scale package includes a semiconductor device invertedly disposed over the carrier such that bond pads of the semiconductor device substantially align with apertures formed through the carrier. Thus, the bond pads of the semiconductor device may communicate with the conductive bumps by means of the conductive material disposed in the apertures of the carrier. Methods of fabricating the carrier of the present invention and methods of fabricating chip-scale packages including the carrier are also within the scope of the present invention.
REFERENCES:
patent: 4341594 (1982-07-01), Carlson et al.
patent: 4618878 (1986-10-01), Aoyama et al.
patent: 4803147 (1989-02-01), Mueller et al.
patent: 4948754 (1990-08-01), Kondo et al.
patent: 5049980 (1991-09-01), Saito et al.
patent: 5111279 (1992-05-01), Pasch et al.
patent: 5168346 (1992-12-01), Pasch et al.
patent: 5207887 (1993-05-01), Crumly et al.
patent: 5275973 (1994-01-01), Gelatos
patent: 5299730 (1994-04-01), Pasch et al.
patent: 5323060 (1994-06-01), Fogal et al.
patent: 5347162 (1994-09-01), Pasch
patent: 5366906 (1994-11-01), Wojnarowski et al.
patent: 5384488 (1995-01-01), Golshan et al.
patent: 5410805 (1995-05-01), Pasch et al.
patent: 5468681 (1995-11-01), Pasch
patent: 5489804 (1996-02-01), Pasch
patent: 5504035 (1996-04-01), Rostoker et al.
patent: 5506756 (1996-04-01), Haley
patent: 5527741 (1996-06-01), Cole et al.
patent: 5554887 (1996-09-01), Sawai et al.
patent: 5565033 (1996-10-01), Gaynes et al.
patent: 5569963 (1996-10-01), Rostoker et al.
patent: 5658827 (1997-08-01), Aulicino et al.
patent: 5672912 (1997-09-01), Aoki et al.
patent: 5677576 (1997-10-01), Akagawa
patent: 5679977 (1997-10-01), Khandros et al.
patent: 5683942 (1997-11-01), Kata et al.
patent: 5770889 (1998-06-01), Rostoker et al.
patent: 5814894 (1998-09-01), Igarashi et al.
patent: 5821624 (1998-10-01), Pasch
patent: 5834799 (1998-11-01), Rostoker et al.
patent: 5834844 (1998-11-01), Akagawa et al.
patent: 5843798 (1998-12-01), Matsuda
patent: 5844304 (1998-12-01), Kata et al.
patent: 5851911 (1998-12-01), Farnworth
patent: 5886409 (1999-03-01), Ishino et al.
patent: 5886415 (1999-03-01), Akagawa
patent: 5907787 (1999-05-01), Sato
patent: 5925931 (1999-07-01), Yamamoto
patent: 5946555 (1999-08-01), Crumly et al.
patent: 5971253 (1999-10-01), Gilleo et al.
patent: 5977641 (1999-11-01), Takahashi et al.
patent: 6030889 (2000-02-01), Aulicino et al.
patent: 6043109 (2000-03-01), Yang et al.
patent: 6054761 (2000-04-01), McCormack et al.
patent: 6069071 (2000-05-01), Hasunuma et al.
patent: 6071810 (2000-06-01), Wada et al.
patent: 6072236 (2000-06-01), Akram et al.
patent: 6117539 (2000-09-01), Crotzer et al.
patent: 6132587 (2000-10-01), Jorne et al.
patent: 6165885 (2000-12-01), Gaynes et al.
patent: 6172569 (2001-01-01), McCall et al.
patent: 6179200 (2001-01-01), Kung et al.
patent: 6181569 (2001-01-01), Chakravorty
patent: 6211572 (2001-04-01), Fjelstad et al.
patent: 6212767 (2001-04-01), Tandy
patent: 6228687 (2001-05-01), Akram et al.
patent: 6233184 (2001-05-01), Barth et al.
patent: 6255737 (2001-07-01), Hashimoto
patent: 6284563 (2001-09-01), Fjelstad
patent: 6285203 (2001-09-01), Akram et al.
patent: 6294407 (2001-09-01), Jacobs
patent: 6306680 (2001-10-01), Fillion et al.
patent: 6319810 (2001-11-01), Ochiai et al.
patent: 6334249 (2002-01-01), Hsu
patent: 6343171 (2002-01-01), Yoshimura et al.
patent: 6348731 (2002-02-01), Ashley et al.
patent: 6376904 (2002-04-01), Haba et al.
patent: 6392306 (2002-05-01), Khandros et al.
patent: 6434017 (2002-08-01), Iwabuchi
patent: 6458231 (2002-10-01), Wapner et al.
patent: 6475896 (2002-11-01), Hashimoto
patent: 6492200 (2002-12-01), Park et al.
patent: 6515370 (2003-02-01), Hashimoto
patent: 6534853 (2003-03-01), Liu et al.
patent: 6573609 (2003-06-01), Fjelstad
patent: 6590292 (2003-07-01), Barber et al.
patent: 2001/0006759 (2001-07-01), Shipley et al.
patent: 2003/0038378 (2003-02-01), Jacobs
Akram Salman
Wood Alan G.
Graybill David E.
Micro)n Technology, Inc.
TraskBritt
LandOfFree
Wafer-level package and methods of fabricating does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Wafer-level package and methods of fabricating, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wafer-level package and methods of fabricating will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3898825