Wafer level mounting frame for ball grid array packaging,...

Details Wafer level mounting frame for ball grid array packaging,... Wafer level mounting frame for ball grid array packaging,...

2007-04-24

2007-04-24

Pert, Evan (Department: 2826)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S125000, C438S613000, C257SE21503

Reexamination Certificate

active

10816413

ABSTRACT:
A method of forming a semiconductor package including placing a semiconductor chip in cavities of a semiconductor chip carrier substrate.

REFERENCES:
patent: 5106461 (1992-04-01), Volfson et al.
patent: 6548895 (2003-04-01), Benavides et al.
patent: 6617674 (2003-09-01), Becker et al.
patent: 6825553 (2004-11-01), Chua et al.
patent: 7074650 (2006-07-01), Honda
patent: 7087991 (2006-08-01), Chen et al.

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