Wafer level interposer

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...

Reexamination Certificate

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C324S754090

Reexamination Certificate

active

09810871

ABSTRACT:
Double-sided interposer assemblies and methods for forming and using them. In one example of the invention, an interposer comprises a substrate having a first surface and a second surface opposite of said first surface, a first plurality of contact elements disposed on said first side of said substrate, and a second plurality of contact elements disposed on said second surface of said substrate, wherein said interposer connects electronic devices via said first and said second plurality of contact elements.

REFERENCES:
patent: 3982159 (1976-09-01), Dennis et al.
patent: 4061969 (1977-12-01), Dean
patent: 4293175 (1981-10-01), Cutchaw
patent: 4523144 (1985-06-01), Okubo et al.
patent: 4567433 (1986-01-01), Ohkubo et al.
patent: 4636722 (1987-01-01), Ardezzone
patent: 4719417 (1988-01-01), Evans
patent: 4780670 (1988-10-01), Cherry
patent: 4820976 (1989-04-01), Brown
patent: 4837622 (1989-06-01), Whann et al.
patent: 4899099 (1990-02-01), Mendenhall
patent: 4906194 (1990-03-01), Grabbe
patent: 4965865 (1990-10-01), Trenary
patent: 4968931 (1990-11-01), Littlebury et al.
patent: 4983907 (1991-01-01), Crowley
patent: 4994735 (1991-02-01), Leedy
patent: 5020219 (1991-06-01), Leedy
patent: 5055778 (1991-10-01), Okubo et al.
patent: 5067007 (1991-11-01), Otsuka et al.
patent: 5088190 (1992-02-01), Malhi et al.
patent: 5090118 (1992-02-01), Kwon et al.
patent: 5102343 (1992-04-01), Knight et al.
patent: 5109596 (1992-05-01), Driller et al.
patent: 5124639 (1992-06-01), Carlin et al.
patent: 5172050 (1992-12-01), Swapp
patent: 5173055 (1992-12-01), Grabbe
patent: 5187020 (1993-02-01), Kwon et al.
patent: 5191708 (1993-03-01), Kasukabe et al.
patent: 5225777 (1993-07-01), Bross et al.
patent: 5228861 (1993-07-01), Grabbe
patent: 5323107 (1994-06-01), D'Souza
patent: 5329226 (1994-07-01), Monnet et al.
patent: 5382898 (1995-01-01), Subramanian
patent: 5395253 (1995-03-01), Crumly
patent: 5399982 (1995-03-01), Driller et al.
patent: 5437556 (1995-08-01), Bargain et al.
patent: 5476211 (1995-12-01), Khandros
patent: 5517126 (1996-05-01), Yamaguchi
patent: 5521518 (1996-05-01), Higgins
patent: 5534784 (1996-07-01), Lum et al.
patent: 5546405 (1996-08-01), Golla
patent: 5550482 (1996-08-01), Sano
patent: 5600257 (1997-02-01), Leas et al.
patent: 5629137 (1997-05-01), Leedy
patent: 5629631 (1997-05-01), Perry et al.
patent: 5642054 (1997-06-01), Pasiecznik, Jr.
patent: 5670889 (1997-09-01), Okubo et al.
patent: 5682064 (1997-10-01), Atkins et al.
patent: 5686842 (1997-11-01), Lee
patent: 5701666 (1997-12-01), DeHaven et al.
patent: 5703494 (1997-12-01), Sano
patent: 5729150 (1998-03-01), Schwindt
patent: 5742170 (1998-04-01), Isaac et al.
patent: 5764072 (1998-06-01), Kister
patent: 5773986 (1998-06-01), Thompson et al.
patent: 5786701 (1998-07-01), Pedder
patent: 5791914 (1998-08-01), Loranger et al.
patent: 5806181 (1998-09-01), Khandros et al.
patent: 5821763 (1998-10-01), Beaman et al.
patent: 5828226 (1998-10-01), Higgins et al.
patent: 5852871 (1998-12-01), Khandros
patent: 5917707 (1999-06-01), Khandros et al.
patent: 5998228 (1999-12-01), Eldridge et al.
patent: 6002266 (1999-12-01), Briggs et al.
patent: 6014032 (2000-01-01), Maddix et al.
patent: 6040700 (2000-03-01), Berar
patent: 6046597 (2000-04-01), Barabi
patent: 6050829 (2000-04-01), Eldridge et al.
patent: 6059982 (2000-05-01), Palagonia et al.
patent: 6060891 (2000-05-01), Hembree et al.
patent: 6087840 (2000-07-01), Mizuta
patent: 6133744 (2000-10-01), Yojima et al.
patent: 6137296 (2000-10-01), Yoon et al.
patent: 6142789 (2000-11-01), Nolan
patent: 6150830 (2000-11-01), Schmid et al.
patent: 6160412 (2000-12-01), Martel et al.
patent: 6169409 (2001-01-01), Amemiya
patent: 6174744 (2001-01-01), Watanabe et al.
patent: 6181567 (2001-01-01), Roemer et al.
patent: 6204455 (2001-03-01), Gilleo et al.
patent: 6215320 (2001-04-01), Parrish
patent: 6215321 (2001-04-01), Nakata
patent: 6246250 (2001-06-01), Doherty et al.
patent: 6275052 (2001-08-01), Hembree et al.
patent: 6289583 (2001-09-01), Belmont et al.
patent: 6307392 (2001-10-01), Soejima et al.
patent: 6344752 (2002-02-01), Hagihara et al.
patent: 6351134 (2002-02-01), Leas et al.
patent: 6354844 (2002-03-01), Coico et al.
patent: 6359455 (2002-03-01), Takekoshi
patent: 6429029 (2002-08-01), Eldridge et al.
patent: 6452407 (2002-09-01), Khoury et al.
patent: 6468098 (2002-10-01), Eldridge
patent: 6483328 (2002-11-01), Eldridge
patent: 6991969 (2006-01-01), Johnson
patent: 2001/0012704 (2001-08-01), Eldridge
patent: 2001/0020747 (2001-09-01), Eldridge et al.
patent: 2001/0054905 (2001-12-01), Khandros et al.
patent: 2002/0004320 (2002-01-01), Pedersen
patent: 2002/0197895 (2002-12-01), Eldridge
patent: 2003/0057975 (2003-03-01), Eslamy et al.
patent: 463684 (1992-01-01), None
patent: 1349786 (1974-04-01), None
patent: 58178293 (1983-11-01), None
patent: 6244285 (1987-03-01), None
patent: 62-142279 (1987-06-01), None
patent: 6363777 (1988-04-01), None
patent: 63243768 (1988-10-01), None
patent: 3-065659 (1991-03-01), None
patent: 365659 (1991-03-01), None
patent: 4-207047 (1992-07-01), None
patent: 5-029406 (1993-02-01), None
patent: 529406 (1993-02-01), None
patent: 650990 (1994-02-01), None
patent: 6273445 (1994-09-01), None
patent: 6313775 (1994-11-01), None
patent: 8-015318 (1996-01-01), None
patent: 334607 (1998-06-01), None
patent: WO 00/01208 (2000-01-01), None
patent: WO 00/33096 (2000-06-01), None
patent: WO 00/75677 (2000-12-01), None
patent: WO 01/13130 (2001-02-01), None
Best et al., “Flexible Probe,” IBM Technical Disclosure Bulletin, vol. 15 No. 11 (Apr. 1973), pp. 3428-3429.
Leung et al., “Active Substrate Membrane Probe Card,” Technical Digest of the International Electron Devices Meeting (IEDM) (Oct. 12, 1995), pp. 709-712.
Emsworth, “High Density Probe Assembly,” Research Disclosure 2244, No. 333, p. 33391 (Jan. 1992).
“Portable, Small Contact Area Surface Resistance Probe Assembly,” IBM Technical Disclosure Bulletin, vol. 37, No. 2B (Feb. 1994).

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