Wafer-level flipchip package with IC circuit isolation

Details Wafer-level flipchip package with IC circuit isolation Wafer-level flipchip package with IC circuit isolation

2006-03-14

2008-11-11

Kebede, Brook (Department: 2894)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S612000, C257SE21511

Reexamination Certificate

active

07449365

ABSTRACT:
Forming a wafer level chip scale flip chip package includes determining isolation requirements of an integrated circuit formed in a semi conductive substrate from package signal connections of the wafer level chip scale flip chip package. Operation may further include, based upon the integrated circuit characteristics, selecting a thickness of at least one dielectric layer isolating a top metal layer of the integrated circuit from the package signal connections of the wafer level chip scale flip chip package, determining a minimum pitch of the package signal connections of the wafer level chip scale flip chip package, and determining a maximum lateral distance from the signal pad to a servicing package signal connection of the wafer level chip scale flip chip package and determining a position of the servicing package signal connection of the wafer level chip scale flip chip package based upon the maximum lateral distance.

REFERENCES:
patent: 5534465 (1996-07-01), Frye et al.
patent: 5728606 (1998-03-01), Laine et al.

Affiliated with

Also associated with

Rating

Wafer-level flipchip package with IC circuit isolation does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wafer-level flipchip package with IC circuit isolation, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wafer-level flipchip package with IC circuit isolation will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4039778