Wafer-level fabrication method for top or side slider bond pads

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C029S603110, C029S603130, C029S603150, C029S603180, C029S417000, C205S103000, C205S105000, C205S123000, C216S039000, C216S041000, C216S048000, C360S235700, C360S235800, C360S236500, C360S237000, C451S005000, C451S041000, C438S138000

Reexamination Certificate

active

10263891

ABSTRACT:
A method is used for fabricating sliders for use in a disc drive actuation system, the sliders having bonds pads formed on either a top surface or side faces of the slider. The method comprises providing a substrate having a top surface. Trenches are formed in the substrate and filled with a bond pad material to form slider bond pads. Excess bond pad material is removed from the trenches such that the slider bond pads are flush with the top surface of the substrate. A transducer is fabricated on the top surface of the substrate. Finally, the slider bond pads are exposed.

REFERENCES:
patent: 5276573 (1994-01-01), Harada et al.
patent: 5501893 (1996-03-01), Laermer et al.
patent: 5657186 (1997-08-01), Kudo et al.
patent: 5708540 (1998-01-01), Ananth et al.
patent: 5770465 (1998-06-01), MacDonald et al.
patent: 6074896 (2000-06-01), Dando
patent: 6140674 (2000-10-01), Hause et al.
patent: 6344949 (2002-02-01), Albrecht et al.
patent: 6524461 (2003-02-01), Taylor et al.
patent: 59185014 (1984-10-01), None
patent: 03034110 (1991-02-01), None
“A novel trench planarization technique using polysilicon refill, polysilicon oxidation, and oxide etchback”; Shenai, K.; Electron Devices, IEEE Transactions on vol. 40, Issue 2, Feb. 1993; pp. 459-463.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Wafer-level fabrication method for top or side slider bond pads does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wafer-level fabrication method for top or side slider bond pads, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wafer-level fabrication method for top or side slider bond pads will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3843366

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.