Wafer level electro-optical sort testing and wafer level...

Details Wafer level electro-optical sort testing and wafer level... Wafer level electro-optical sort testing and wafer level...

2005-05-10

2005-05-10

Chowdhury, Tarifur R. (Department: 2871)

Liquid crystal cells, elements and systems

Nominal manufacturing methods or post manufacturing...

Injecting liquid crystal

C349S187000, C349S190000, C324S701000

Reexamination Certificate

active

06891592

ABSTRACT:
A method of manufacturing liquid crystal devices on a silicon substrate is disclosed. Such a method is accomplished by preparing a silicon substrate having a plurality of die arranged in an array with scribe streets between the dies, and alignment marks within designated scribe streets; preparing a glass substrate having scribe lines, alignment marks within designated scribe lines and openings for filing liquid crystal; attaching the glass substrate to the silicon substrate using the alignment marks on the glass substrate and on the silicon substrate to form a silicon-glass assembly; filling liquid crystal, via the openings on the glass substrate, into a cell gap of each die on the silicon-glass assembly, and sealing the openings on each die to form a liquid crystal device; and separating liquid crystal devices from the silicon-glass assembly along the scribe lines on the glass substrate.

REFERENCES:
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patent: 5963281 (1999-10-01), Koons et al.
patent: 5963289 (1999-10-01), Stefanov et al.
patent: 6195149 (2001-02-01), Kodera et al.
patent: 6487461 (2002-11-01), Gaynes et al.
patent: 20010004278 (2001-06-01), Fukumori et al.
patent: 20020159020 (2002-10-01), Sojourner et al.

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