Wafer level contact sheet and method of assembly

Details Wafer level contact sheet and method of assembly Wafer level contact sheet and method of assembly

1996-11-08

1998-06-16

Niebling, John

Semiconductor device manufacturing: process

With measuring or testing

Packaging or treatment of packaged semiconductor

438613, 438118, H01L 2166, H01L 2144

Patent

active

057669791

ABSTRACT:
The present invention relates to a system and method for performing reliability screening on semi-conductor wafers and particularly to a highly planar burn in apparatus and method for uses including wafer level burn-in (WLBI), diced die burn-in (DDBI), and packaged die burn-in (PDBI). The burn-in system includes a burn-in substrate with a planar base, a temporary Z-axis connecting member, and a Z-axis wafer level contact sheet electrically coupled to one another for screening wafers, diced die, and packaged electronic components, their assembly and use.

REFERENCES:
patent: Re26837 (1970-03-01), Evans
patent: 3609547 (1971-09-01), Slusser
patent: 3736471 (1973-05-01), Donze et al.
patent: 3953566 (1976-04-01), Gore
patent: 4133592 (1979-01-01), Cobaugh et al.
patent: 4482516 (1984-11-01), Bowman et al.
patent: 4530779 (1985-07-01), Mayama et al.
patent: 4540229 (1985-09-01), Madden
patent: 4683550 (1987-07-01), Jindrick et al.
patent: 4705762 (1987-11-01), Ota et al.
patent: 4733461 (1988-03-01), Nakano
patent: 4783695 (1988-11-01), Eichelberger et al.
patent: 4840570 (1989-06-01), Mann, Jr. et al.
patent: 4963225 (1990-10-01), Lehman-Lamer
patent: 4968931 (1990-11-01), Littlebury et al.
patent: 4985296 (1991-01-01), Mortimer, Jr.
patent: 5007163 (1991-04-01), Pope et al.
patent: 5252857 (1993-10-01), Kane et al.
patent: 5289631 (1994-03-01), Koopman et al.
patent: 5315481 (1994-05-01), Smolley
patent: 5366906 (1994-11-01), Wojnaroski et al.
patent: 5380210 (1995-01-01), Gabbe et al.
patent: 5428190 (1995-06-01), Stopperan
patent: 5432677 (1995-07-01), Mowatt et al.
patent: 5437556 (1995-08-01), Bargain et al.
patent: 5440240 (1995-08-01), Wood et al.
patent: 5461328 (1995-10-01), Devereaux et al.
patent: 5498467 (1996-03-01), Meola
patent: 5527741 (1996-06-01), Cole et al.
patent: 5541524 (1996-07-01), Tuckerman et al.
patent: 5567657 (1996-10-01), Wojnarowski et al.
patent: 5597737 (1997-01-01), Greer et al.
patent: 5602491 (1997-02-01), Vasquez et al.
patent: 5634267 (1997-06-01), Farnworth et al.
Pending U.S. patent application Ser. No. 08/724,393, filed Oct. 1, 1996, entitled "A Reusable, Selectively Conductive, Z-Axis, Elastomeric Composite Substrate".

Affiliated with

Also associated with

Rating

Wafer level contact sheet and method of assembly does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wafer level contact sheet and method of assembly, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wafer level contact sheet and method of assembly will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1725242