Wafer level chip scale package system with a thermal...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor

Reexamination Certificate

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Details

C438S113000, C438S118000, C438S122000, C257S707000, C257S783000, C257SE21001

Reexamination Certificate

active

07939368

ABSTRACT:
A wafer level chip scale package system is provided forming a wafer having an interconnect provided on an active side, forming a thermal sheet having a first thermal interface material layer and a thermal conductive layer, and attaching the thermal sheet on a non-active side of the wafer.

REFERENCES:
patent: 5533256 (1996-07-01), Call et al.
patent: 5851845 (1998-12-01), Wood et al.
patent: 5854741 (1998-12-01), Shim et al.
patent: 6046498 (2000-04-01), Yoshikawa
patent: 6432497 (2002-08-01), Bunyan
patent: 6667548 (2003-12-01), O'Connor et al.
patent: 6797544 (2004-09-01), Ozono et al.
patent: 6853068 (2005-02-01), Djekic
patent: 6916688 (2005-07-01), Kelkar et al.
patent: 6987671 (2006-01-01), Houle
patent: 7094618 (2006-08-01), Tandy et al.
patent: 7112469 (2006-09-01), Mihara
patent: 7169685 (2007-01-01), Connell et al.
patent: 7387911 (2008-06-01), Audette et al.
patent: 7435664 (2008-10-01), Lu et al.
patent: 2001/0016369 (2001-08-01), Zandman et al.
patent: 2002/0173077 (2002-11-01), Ho et al.
patent: 2004/0113283 (2004-06-01), Farnworth et al.
patent: 2005/0136640 (2005-06-01), Hu et al.
patent: 2005/0287766 (2005-12-01), Chrysler et al.
“McGraw-Hill Dictionary of Scientific and Technical Terms, Sixth Edition”, 2003, p. 526, Publisher: McGraw-Hill, Published in: New York.

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