Wafer level chip scale package of image sensor and...

Details Wafer level chip scale package of image sensor and... Wafer level chip scale package of image sensor and...

2007-09-28

2011-11-08

Mitchell, James (Department: 2813)

Active solid-state devices (e.g., transistors, solid-state diode

Physical configuration of semiconductor

With peripheral feature due to separation of smaller...

C257S059000, C257S222000

Reexamination Certificate

active

08053868

ABSTRACT:
Provided are a wafer level chip scale package of an image sensor and a manufacturing method thereof. The wafer level chip scale package includes: a wafer including an image sensor and a pad on the top surface thereof and inclined surfaces on both ends thereof; expansion pads formed on the inclined surfaces of the wafer, including the pad, such that the expansion pads are electrically connected to the pad, a bottom surface of the expansion pads being on a straight line with respect to that of the wafer; a support formed on the expansion pads to support both bottom surfaces of a glass, the support having a height to provide a space where an air cavity is formed; and a glass disposed on the support to provide the air cavity over the wafer.

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