Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Patent
1996-11-08
1999-03-23
Brown, Glenn W.
Electricity: measuring and testing
Fault detecting in electric circuits and of electric components
Of individual circuit component or element
324765, 29830, 439 65, 438 14, G01R 3126, H01L 2166, H01L 23485
Patent
active
058865357
ABSTRACT:
The present invention relates to a system and method for performing reliability screening on semi-conductor wafers and particularly to a highly planar burn in apparatus and method for uses including wafer level bum-in (WLBI), diced die burn-in (DDBI), and packaged die burn-in (PDBI). The burn-in system includes a burn-in substrate with a planar base, a temporary Z-axis connecting member, and a Z-axis wafer level contact sheet electrically coupled to one another for screening wafers, diced die, and packaged electronic components, their assembly and use.
REFERENCES:
patent: Re26837 (1970-03-01), Evans
patent: 3609547 (1971-09-01), Slusser
patent: 3736471 (1973-05-01), Donze et al.
patent: 3953566 (1976-04-01), Gore
patent: 4133592 (1979-01-01), Cobaugh et al.
patent: 4482516 (1984-11-01), Bowman et al.
patent: 4530779 (1985-07-01), Mayama et al.
patent: 4540229 (1985-09-01), Madden
patent: 4654248 (1987-03-01), Mohammed
patent: 4683550 (1987-07-01), Jindrick et al.
patent: 4705762 (1987-11-01), Ota et al.
patent: 4733461 (1988-03-01), Nakano
patent: 4840570 (1989-06-01), Mann, Jr. et al.
patent: 4963225 (1990-10-01), Lehman-Lamer
patent: 4968931 (1990-11-01), Littlebury et al.
patent: 4985296 (1991-01-01), Mortimer, Jr.
patent: 5007163 (1991-04-01), Pope et al.
patent: 5034801 (1991-07-01), Fischer
patent: 5100740 (1992-03-01), Neugebauer et al.
patent: 5231055 (1993-07-01), Smith
patent: 5252857 (1993-10-01), Kane et al.
patent: 5315481 (1994-05-01), Smolley
patent: 5380210 (1995-01-01), Grabbe et al.
patent: 5389885 (1995-02-01), Swart
patent: 5420796 (1995-05-01), Weling et al.
patent: 5428190 (1995-06-01), Stopperan
patent: 5437556 (1995-08-01), Bargain et al.
patent: 5440240 (1995-08-01), Wood et al.
patent: 5461328 (1995-10-01), Devereaux et al.
patent: 5498467 (1996-03-01), Meola
patent: 5541524 (1996-07-01), Tuckerman et al.
patent: 5602491 (1997-02-01), Vasquez et al.
patent: 5766979 (1998-06-01), Budnaitis
patent: 5830565 (1998-11-01), Budnaitis
Brown Glenn W.
Genco, Jr. Victor M.
W. L. Gore & Associates, Inc.
LandOfFree
Wafer level burn-in base unit substrate and assembly does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Wafer level burn-in base unit substrate and assembly, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wafer level burn-in base unit substrate and assembly will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2130010