Wafer level bumpless method of making a flip chip mounted...

Details Wafer level bumpless method of making a flip chip mounted... Wafer level bumpless method of making a flip chip mounted...

2007-04-10

2007-04-10

Fourson, George (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S111000, C438S119000, C438S613000, C257SE23040, C257SE23020, C257SE23046, C257SE23053

Reexamination Certificate

active

11149954

ABSTRACT:
A wafer level bumpless method of making flip chip mounted semiconductor device packages is disclosed. The method includes the steps of solder mask coating a semiconductor die wafer frontside, processing the solder mask coating to reveal a plurality of gate contact and a plurality of source contacts, patterning a lead frame with target dimple areas, creating dimples in the lead frame corresponding to the gate contact and source contacts, printing a conductive epoxy on the lead frame in the dimples, curing the lead frame and semiconductor die wafer together, and dicing the wafer to form the semiconductor device packages.

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