Wafer level alignment structures using subwavelength grating...

Optics: measuring and testing – By alignment in lateral direction

Reexamination Certificate

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C356S369000

Reexamination Certificate

active

08004678

ABSTRACT:
In one embodiment, a wafer alignment system, comprises a radiation source to generate radiation, a radiation directing assembly to direct at least a portion of the radiation onto a surface of a wafer, the radiation having a polarization state, an optical analyzer to collect at least a portion of the radiation reflected from the wafer, the wafer including at least a first region having a first grating pattern oriented in a first direction and at least a second region having a second grating pattern oriented in a second direction, different from the first direction.

REFERENCES:
patent: 2004/0169861 (2004-09-01), Mieher et al.
patent: 2005/0286052 (2005-12-01), Huggins et al.
patent: 2006/0044568 (2006-03-01), Weiss
Flanders, Dale C., “Submicrometer periodicity gratings as artificial anisotropic dielectrics”,Applied Physics Letters 42(6), (Mar. 15, 1983), pp. 492-494.
Zeitner, U.D. et al., “Diffractive Optical Elements with Polarization-Multiplexing”,SPIEvol. 3099, pp. 189-194.

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