Wafer lapping method capable of achieving a stable abrasion rate

Details Wafer lapping method capable of achieving a stable abrasion rate Wafer lapping method capable of achieving a stable abrasion rate

1996-12-06

2000-08-15

Banks, Derris H.

Abrading

Abrading process

Glass or stone abrading

451285, 451287, B24B 100

Patent

active

061027782

ABSTRACT:
In a wafer lapping method including a first step of lapping irregularities of a surface of a wafer to flatten the surface of the wafer by pressing the surface of the wafer against an abrasion pad (2) with an abrasive agent containing abrasive particles fed onto the abrasion pad, the method further includes a second step of feeding, instead of the abrasive agent upon completion of the lapping step, onto the abrasion pad a chemical solution (6) for use in preventing agglomeration of the abrasive particles contained in the abrasive agent which remains on the abrasion pad. This results in preventing the abrasion pad from drying. Following the second step, a third step is carried out for lapping irregularities of a surface of a different wafer to flatten the surface of the different wafer by pressing the surface of the different wafer against the abrasion pad with the abrasive agent fed onto the abrasion pad instead of the chemical solution. For the the different wafer, an abrasion rate can be obtained which is similar to that for the wafer.

REFERENCES:
patent: 5167667 (1992-12-01), Prigge et al.
patent: 5216843 (1993-06-01), Breivogel et al.
patent: 5329732 (1994-07-01), Karlsrud et al.
patent: 5421768 (1995-06-01), Fujiwara et al.
patent: 5536202 (1996-07-01), Appel et al.
patent: 5584749 (1996-12-01), Mitsuhashi et al.
patent: 5643067 (1997-07-01), Katsuoka et al.

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