Wafer inspection system and method thereof

Details Wafer inspection system and method thereof Wafer inspection system and method thereof

2005-05-19

2009-10-13

Geyer, Scott B. (Department: 2812)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Reexamination Certificate

active

07601555

ABSTRACT:
A wafer inspection system includes an electrical testing part to control a probe to be in contact with a pad of a wafer to perform a predetermined electrical test, a defect detecting part to detect a defect in the wafer passing through the electrical test, a defect sorting part to sort the defect detected in the defect detecting part by an in-line method, and a defective determining part to determine whether the wafer is a defective according to a sorting result of the defect sorting part. The wafer inspection system and a method thereof can determine the kinds of the defect in the wafer during a fabricating procedure, so that it is possible to instantly and correctly determine whether the die on the wafer is a defective.

REFERENCES:
patent: 6338001 (2002-01-01), Steffan et al.
patent: 6593152 (2003-07-01), Nakasuji et al.
patent: 2002/0187582 (2002-12-01), Satya et al.
patent: 2003/0207475 (2003-11-01), Nakasuji et al.
patent: 2001-30320 (2001-04-01), None
patent: 1020010039251 (2001-05-01), None
patent: 2001-53427 (2001-06-01), None
patent: 1020030083563 (2003-10-01), None
Korean Office Action dated Jan. 26, 2006 of Korean Patent Application No. 10-2004-0045747.

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