Wafer inspection system

Details Wafer inspection system Wafer inspection system

2007-12-11

2007-12-11

Barlow, John (Department: 2863)

Data processing: measuring, calibrating, or testing

Measurement system in a specific environment

Mechanical measurement system

C702S036000

Reexamination Certificate

active

10771628

ABSTRACT:
A method and system for identifying a defect or contamination on a surface of a material. The method and system involves providing a material, such as a semiconductor wafer, using a non-vibrating contact potential difference sensor to scan the wafer, generate contact potential difference data and processing that data to identify a pattern characteristic of the defect or contamination.

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