Wafer inspection apparatus

Details Wafer inspection apparatus Wafer inspection apparatus

2006-12-12

2006-12-12

Mancuso, Joseph (Department: 2624)

Image analysis

Applications

Manufacturing or product inspection

C356S237400

Reexamination Certificate

active

07149341

ABSTRACT:
A wafer inspection apparatus has a supporting means (10) for rotatably supporting a wafer (W) formed of a disk, a circumferential edge imaging means (40) for imaging a circumferential edge (S) of the wafer (W) that is supported by the supporting means for rotation, a notch imaging means (50) for imaging a notch (N), a notch illumination part (52) for illuminating the notch (N), and a control means (70) for processing image data imaged by the circumferential edge imaging means (40) and the notch imaging means (50). The circumferential edge imaging means (40) has a plurality of imaging cameras (41) for imaging a plurality of different parts in a thickness direction of the circumferential edge of the wafer (W). The different parts of the circumferential edge (S) of the wafer (W) include an apex at right angles to a surface of the wafer (W) and a front side bevel and a back side bevel inclined relative to the apex. The notch imaging means (50) for the wafer (W) having the notch (N) has a plurality of imaging cameras (51) for imaging different parts in the thickness direction of the notch (N).

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The Wafer's Edge, Alexander E. Braun, Senior Editor—Semiconductor International, Mar. 1, 2006, http://www.reed-electronics.com/semiconductor/article/CA6309190.html.

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