Wafer including scribe line grooves for separating thin film hea

Details Wafer including scribe line grooves for separating thin film hea Wafer including scribe line grooves for separating thin film hea

1995-06-05

1998-11-10

Powell, William

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216 41, G11B 5147, B44C 122

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058353151

ABSTRACT:
A method for pattern-etching thick alumina layers in the manufacture of thin film heads (TFH) by using compatible metallic mask layers and an alumina etchant. The deep alumina etching enables the formation of scribe-line grooves of street and alleys across the wafer for sawing and machining of sliders. These grooves eliminate most alumina chipping due to stress and damage introduced by the sawing and machining operations.

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