Wafer holding plate for wafer grinding apparatus and method...

Details Wafer holding plate for wafer grinding apparatus and method... Wafer holding plate for wafer grinding apparatus and method...

2006-04-18

2006-04-18

Wilson, Lee D. (Department: 3723)

Abrading

Abrading process

Combined abrading

C451S041000, C451S285000, C451S398000

Reexamination Certificate

active

07029379

ABSTRACT:
A method for manufacturing a wafer holding plate for a wafer grinding apparatus wherein the plate includes a substrate having a wafer adhering surface to which a semiconductor wafer is adhered by an adhesive. The wafer adhering surface includes a mirror-like surface portion and a groove pattern, which anchors the adhesive. When the plate is used for grinding wafers, the quality and accuracy of the finished wafers is greatly improved.

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European Search Report Dated Oct. 2, 2003.

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