Wafer holding plate for wafer grinding apparatus and method...

Details Wafer holding plate for wafer grinding apparatus and method... Wafer holding plate for wafer grinding apparatus and method...

Filed on

2005-07-12

Date issued

2005-07-12

Examiner

Wilson, Lee D. (Department: 3723)

Patent Class

Abrading

SubClass

Abrading process

SubSubClass

Combined abrading

Other Related Categories

C451S285000, C451S398000

Type

Reexamination Certificate

Status

active

Patent number

06916228

Description

ABSTRACT:
A wafer holding plate for a wafer grinding apparatus. The plate includes a substrate having a wafer adhering surface to which a semiconductor wafer is adhered by an adhesive. The wafer adhering surface includes a mirror-like surface portion and a groove pattern, which anchors the adhesive. When the plate is used for grinding wafers, the quality and accuracy of the finished wafers is greatly improved.

REFERENCES:
patent: 5423716 (1995-06-01), Strasbaugh
patent: 5651724 (1997-07-01), Kimura et al.
patent: 5797789 (1998-08-01), Tanaka et al.
patent: 5951374 (1999-09-01), Kato et al.
patent: 6112740 (2000-09-01), Wark et al.
patent: 0786 803 (1997-07-01), None
patent: 0887152 (1998-12-01), None
patent: 1 020 253 (2000-07-01), None
patent: 04115865 (1992-04-01), None
European Search Report Dated Oct. 2, 2003.

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