Wafer holder with spring-loaded wafer-holding means

Photocopying – Projection printing and copying cameras – Detailed holder for original

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

269321WE, 355 53, 355132, G01N 2130, G03B 2702, G03B 2762, H01L 2168

Patent

active

041892305

ABSTRACT:
A semiconductor wafer holder, for use in discharge and other processing apparatus, comprised of a non-magnetic frame having an opening defined by an inner wall for receiving a wafer. A non-magnetic circular flange extends out from the frame body over the inner wall forming a bottom surface extending partially into the opening. The bottom surface acts as a mechanical stop for the top surface of a wafer forced up into the opening by a spring-loaded bottom plate. A spring-loaded plunger mechanism extends through a hole in the frame and inner wall into the opening to contact the side edge of a wafer in the opening and forces the wafer into contact with side-edge mechanical stops.

REFERENCES:
patent: 3569718 (1971-03-01), Borner
patent: 3577682 (1971-05-01), Kulischenko
patent: 3645622 (1972-02-01), Cachon et al.
patent: 4093378 (1978-06-01), Horr et al.
I.B.M. Technical Disclosure Bulletin, vol. 17, No. 12, May 1975, p. 3577, Wafer Positioner Caccoma et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Wafer holder with spring-loaded wafer-holding means does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wafer holder with spring-loaded wafer-holding means, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wafer holder with spring-loaded wafer-holding means will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-651195

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.