Wafer holder for semiconductor applications

Details Wafer holder for semiconductor applications Wafer holder for semiconductor applications

1995-10-25

1997-12-30

Nguyen, Vinh P.

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

324765, G01R 104

Patent

active

057034931

ABSTRACT:
A semiconductor substrate (15) is placed into a recessed area (12) of a support structure (10). A ring (20) is then placed on the support structure (10) to form a wafer holder (30) which provides support to the semiconductor substrate (15) during handling, transporting, or electrical testing operations. The recessed area (12) can also have a vacuum opening (13) and a vacuum groove (17) so a vacuum pressure can be applied to the backside of semiconductor substrate (15). This will correct for any warpage or bowing in the semiconductor substrate (15) so a planar surface is formed for the electrical testing operation. The wafer holder (30) also has a flat (16) so the wafer holder (30) can be aligned and processed like a wafer with a diameter larger than the semiconductor substrate (15).

REFERENCES:
patent: 3729206 (1973-04-01), Cachon et al.
patent: 3936743 (1976-02-01), Roch
patent: 3949295 (1976-04-01), Moorshead
patent: 4066943 (1978-01-01), Roch
patent: 4213698 (1980-07-01), Firtion et al.
patent: 4955590 (1990-09-01), Narushima et al.
patent: 5479108 (1995-12-01), Cheng

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