Wafer holder, and wafer prober provided therewith

Details Wafer holder, and wafer prober provided therewith Wafer holder, and wafer prober provided therewith

2007-02-02

2009-08-18

Paik, Sang Y (Department: 3742)

Electric heating

Heating devices

Combined with container, enclosure, or support for material...

C118S724000

Reexamination Certificate

active

07576303

ABSTRACT:
A wafer holder is provided having high rigidity and an enhanced heat-insulating effect that allow positional accuracy and heating uniformity to be improved, a chip to be rapidly heated and cooled, and the manufacturing cost to be reduced, and a wafer prober apparatus on which the wafer holder is mounted. The wafer holder of the present invention includes a chuck top for mounting a wafer, a support member for supporting the chuck top, and a stand for supporting the support member. The chuck top has a thermal conductivity K1and a Young's modulus Y1; the support member has a thermal conductivity K2and a Young's modulus Y2; and the stand has a thermal conductivity K3and a Young's modulus Y3. K1>K2and K1>K3; and Y3>Y1and Y3>Y2.

REFERENCES:
patent: 5851298 (1998-12-01), Ishii
patent: 6639189 (2003-10-01), Ramanan et al.
patent: 2004/0169033 (2004-09-01), Kuibira et al.
patent: 2001-033484 (2001-02-01), None
patent: 2004-014655 (2004-01-01), None
patent: 2004-363372 (2004-12-01), None

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