Wafer holder and semiconductor manufacturing apparatus

Electric heating – Heating devices – Combined with container – enclosure – or support for material...

Reexamination Certificate

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Details

C118S724000

Reexamination Certificate

active

10498460

ABSTRACT:
A wafer holder is provided in which local heat radiation in supporting and heating wafers is kept under control and temperature uniformity of the wafer retaining surface is enhanced, and by making use of the wafer holder a semiconductor manufacturing apparatus suitable for processing larger-diameter wafers is made available. In a wafer holder (1) including within a ceramic substrate (2) a resistive heating element (3) or the like and being furnished with a lead (4) penetrating a reaction chamber (6), the lead (4) is housed in a tubular guide member (5), and an interval between the guide member (5) and the reaction chamber (6) as well as the interior of the guide member (5) are hermetically sealed. The guide member (5) and the ceramic substrate (2) are not joined together, and in the interior of the guide member (5) in which the inside is hermetically sealed, the atmosphere toward the ceramic substrate (2) is preferably substantially the same as the atmosphere in the reaction chamber (6).

REFERENCES:
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patent: 5306895 (1994-04-01), Ushikoshi et al.
patent: 5688331 (1997-11-01), Aruga et al.
patent: 6204488 (2001-03-01), Toya et al.
patent: 6376808 (2002-04-01), Tachikawa et al.
patent: H05-267191 (1993-10-01), None
patent: H06-077148 (1994-03-01), None
patent: H06-028258 (1994-04-01), None
patent: H06-124907 (1994-05-01), None
patent: 2525974 (1996-05-01), None
patent: 2001-319758 (2001-11-01), None
patent: 2002-299432 (2002-10-01), None

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