Wafer holder and method of producing a semiconductor wafer

Details Wafer holder and method of producing a semiconductor wafer Wafer holder and method of producing a semiconductor wafer

1998-05-29

2000-09-12

Utech, Benjamin L.

Semiconductor device manufacturing: process

Chemical etching

Combined with the removal of material by nonchemical means

438692, H01L 21302, H01L 21461

Patent

active

061177768

ABSTRACT:
A wafer holder chuck has support for fixing a semiconductor wafer during nding. There is a method of producing a semiconductor wafer which has two flat-ground sides and a rounded edge. The wafer holder has a support which is composed of a soft material. The method has the semiconductor wafer fixed on a wafer holder having a soft support during grinding of the first side and has the wafer fixed on a wafer holder having a hard support during grinding of the second side.

REFERENCES:
patent: 4239567 (1980-12-01), Winings
patent: 4597228 (1986-07-01), Koyama et al.
patent: 5316620 (1994-05-01), Hasegawa et al.
patent: 5400548 (1995-03-01), Huber et al.
patent: 5429711 (1995-07-01), Watanabe et al.
patent: 5618227 (1997-04-01), Tsutsumi et al.
patent: 5756399 (1998-05-01), Hajime et al.
patent: 5851924 (1998-12-01), Nakazawa et al.
patent: 5891353 (1999-04-01), Masumura et al.
patent: 5895583 (1999-04-01), Augustine et al.
patent: 5914053 (1999-06-01), Masumura et al.
patent: 5961372 (1999-10-01), Shendon

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