Drying and gas or vapor contact with solids – Apparatus – With means to treat gas or vapor
Patent
1994-12-16
1996-09-17
Lopez, F. Daniel
Drying and gas or vapor contact with solids
Apparatus
With means to treat gas or vapor
34239, 211 41, 414935, F26B 2106
Patent
active
055556345
ABSTRACT:
A wafer holder for handling wafers, particularly during a vapor drying process during automated wafer processing, provides for change of the diameter of the wafers to be held without replacement of one wafer holder with another in a wafer processing apparatus. The wafer holder is a unitary structure having a plurality of wafer holding portions, each wafer holding portion having a geometry appropriate to a single wafer diameter which differs from the diameter of wafers to be held by other wafer holding portions of the unitary structure. The wafer holder is preferably secured onto a robot arm in the wafer processing apparatus and can be rotated in orientation by a mechanical linkage in the robot arm in order to receive and hold wafers of a specific diameter being processed in the wafer processing apparatus at any given time. When wafers of another, different, diameter are to be processed, the unitary structure is rotated, preferably in an automatic fashion, to rapidly present a geometry of another wafer holder portion appropriate to the new wafer diameter by bringing the wafer holder to a changed orientation.
REFERENCES:
patent: 4777970 (1988-10-01), Kusuhara
patent: 4858764 (1989-08-01), Domokos
patent: 5191908 (1993-03-01), Hiroe et al.
IBM Technical Disclosure Bulletin, vol. 18, No. 12, May 1976; "Repeatedly Oriented, Univeersal Wafer Chuck"; G. W. Ringel; pp. 4086-4087.
Kudo Hideo
Uchiyama Isao
Lopez F. Daniel
Shin-Etsu Handotai & Co., Ltd.
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