Wafer heating apparatus

Details Wafer heating apparatus Wafer heating apparatus

1998-12-22

2000-06-27

Walberg, Teresa

Electric heating

Heating devices

Combined with container, enclosure, or support for material...

118725, 219540, H05B 368

Patent

active

060809701

ABSTRACT:
In order to achieve concentric distribution of temperatures over a wafer supporting surface and improve the uniformity of heating, a heating resistor 4 having a configuration for providing a predetermined heater pattern buried in a ceramic substrate 2 constituting a wafer heating apparatus is made from arc portions 4a-4g which have different radii and are arranged to form concentric circles disposed at substantially the same intervals and straight portions 4h-4m which connect those of the arc portions 4a-4g that are adjacent to each other in the radial direction thereby to form a series circuit, while the arc portions 4a-4g and the straight portions 4h-4m are made in substantially the same strip width and the distance L1 between a pair of straight portions among the straight portions 4h-4m which are located on the same circle is made less than the distance L2 between the arc portions which are adjacent to each other in the radial direction.

REFERENCES:
patent: 5063031 (1991-11-01), Sato
patent: 5336324 (1994-08-01), Stall et al.
patent: 5343022 (1994-08-01), Gilbert, Sr. et al.
patent: 5344492 (1994-09-01), Sato et al.
patent: 5700992 (1997-12-01), Honda et al.
patent: 5766363 (1998-06-01), Mizuno et al.
patent: 5904872 (1999-05-01), Arami et al.

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