Wafer having surface contoured to form air bearing surfaces...

Details Wafer having surface contoured to form air bearing surfaces... Wafer having surface contoured to form air bearing surfaces...

2005-05-10

2005-05-10

Noland, Thomas P. (Department: 2856)

Dynamic magnetic information storage or retrieval

Fluid bearing head support

Disk record

C360S235300, C360S234300, C073S105000

Reexamination Certificate

active

06891698

ABSTRACT:
An improved glide head has an air bearing surface with a flatness of less than about 1 μinch. The air bearing surfaces are formed from the very smooth and flat surface of a wafer, preferably prior to slicing the glide heads from the wafer. Thus, a wafer is formed having a flat surface with a plurality of air bearing surface contoured onto the surface. To form a glide head, a transducer can be mounted on the air bearing surface or the surface opposite the air bearing surface, preferably at the wafer level before slicing.

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TDB-ACC-NO: MN 9055002 “Thin Film Magnetic Heads”,IBM Technical Disclosure Bulletin, vol. 21, No. 12, pp. 5002, May 1999.
TDB-ACC-NO: NB9203247, “Dimple/Air Bearing Surface Alignment Process”,IBM Technical Disclosure Bulletin, vol. 34 No. 10B, pp. 247-249, Mar. 1992.

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