Wafer having chips for determining the position of the wafer by

Radiant energy – Means to align or position an object relative to a source or...

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G01N 2300

Patent

active

045647640

ABSTRACT:
A wafer having chips for determining the position of the wafer, at least one of the chips comprising a plurality of first-direction line groups formed on one side portion of the chip and a plurality of second-direction line groups formed on the other region of the chip, the first-direction line groups and the second-direction line groups being orthogonal to each other, each of the first-direction line groups comprising one first-direction main mark and one first-direction code mark expressing the position of the one first-direction main mark, each of the second-direction line groups comprising one second-direction main mark and one second-direction code mark, whereby, by scanning only one of the first-direction line groups and only one of the second-direction line groups by means of an electron beam, the position of the wafer is determined.

REFERENCES:
patent: 3849659 (1974-11-01), O'Keefe
patent: 4125418 (1978-11-01), Vinton
patent: 4327292 (1982-05-01), Wang et al.

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