Wafer handling apparatus and method

Details Wafer handling apparatus and method Wafer handling apparatus and method

2006-06-13

2006-06-13

Keenan, James W. (Department: 3652)

Material or article handling

Apparatus for moving material between zones having different...

C414S805000, C414S939000

Reexamination Certificate

active

07059817

ABSTRACT:
A high-speed wafer-processing apparatus and method that employs a vacuum chamber having at least two wafer transport robots and a process station. The vacuum chamber interfaces with a number of single-wafer load locks that are loaded and unloaded one wafer at a time by a robot in atmosphere. Four load locks are sized to allow for a gentle vacuum cycling of each wafer without significant pumpdown delays. The robots in the vacuum chamber move wafers sequentially from one of the load locks to a process station for processing and then to another one of the load locks for unloading by the atmospheric robot.

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