Wafer handling apparatus and method

Details Wafer handling apparatus and method Wafer handling apparatus and method

1992-04-06

1994-11-01

Brown, David H.

Material or article handling

Apparatus for moving intersupporting articles into, within,...

Stack forming apparatus

294 641, 414627, B65G 6502, B66C 102

Patent

active

H00013730

ABSTRACT:
Apparatus and method are disclosed for providing the transfer of a semiconductor wafer from a first to a second location. The apparatus includes a transfer arm including a plurality of apertures to facilitate the attachment of a bowed wafer, without breakage or frontside contact, to the transfer arm. The size, number and location of the apertures may be determined in accordance with the size of the wafer, the amount of bow, as well as the type of bow (i.e., simple or complex). A plurality of flexible members may be disposed in a one-to-one relationship with the apertures and utilized to achieve a secure vacuum seal of the wafer to the transfer arm.

REFERENCES:
patent: 2798757 (1957-07-01), Jackson
patent: 4050729 (1977-09-01), Hutson
patent: 4282924 (1981-08-01), Faretra
patent: 4389064 (1983-06-01), Laverriere
patent: 4564188 (1986-01-01), McNair
patent: 4687542 (1987-08-01), Davis et al.
patent: 4773687 (1988-09-01), Bush et al.
patent: 4983093 (1991-01-01), Foulke et al.
patent: 4987856 (1991-01-01), Hey et al.
patent: 5013075 (1991-05-01), Littell
patent: 5079903 (1992-01-01), Hakansson
patent: 5118153 (1992-06-01), Allison et al.

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