Wafer handling apparatus and method

Heating – Processes of heating or heater operation – Treating an article – container – batch or body as a unit

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Details

198341, 198344, 198345, 198627, 432122, F27D 300, F27B 914, B65G 4300, B65G 1500

Patent

active

045070784

ABSTRACT:
A wafer handling method and apparatus insures proper centering of a wafer at a work station and controls the heat transferred to the wafer in a baking operation. The amount of heat transferred and the rate at which the heat is transferred to the wafer are regulated by controlling the distance between the wafer and a hot plate. The hot plate is maintained at a constant temperature higher than the bake out or equilibrium temperature to which the wafer is to be heated.

REFERENCES:
patent: 3044297 (1962-07-01), Hanken
patent: 3870460 (1975-03-01), Flint
patent: 4217977 (1980-08-01), Tam
patent: 4276603 (1981-06-01), Beck et al.

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