Wafer handling apparatus

Details Wafer handling apparatus Wafer handling apparatus

1988-10-31

1990-08-28

Morgenstern, Norman

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

118715, 118719, 118733, 414 8, 414225, C23C 1456

Patent

active

049522990

ABSTRACT:
A device (24) for handling semiconduct wafers in a vacuum which includes a wafer-receiving arm (80) located in a vacuum chamber and an operating shaft (76) which extends from the vacuum chamber into an atmospheric chamber. The shaft is driven in an axial direction by means of a motor-driven ball screw drive system (74) and angularly by a rotary motor (106) coupled directly to the shaft. The shaft is sealed to maintain vacuum integrity within the vacuum chamber by means of a FERROFLUIDIC rotary seal (110) and by a static seal in the form of a bellows assembly (111) which moves axially with the shaft.

REFERENCES:
patent: 4563240 (1986-01-01), Shibata et al.
patent: 4584045 (1986-04-01), Richards
patent: 4657617 (1987-04-01), Johnson
patent: 4687542 (1987-08-01), Davis
patent: 4735548 (1988-04-01), Kimata et al.
patent: 4770590 (1988-09-01), Hugues et al.
patent: 4810473 (1989-03-01), Tamura et al.
patent: 4816116 (1989-03-01), Davis et al.

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