Wafer guides for processing semiconductor substrates

Details Wafer guides for processing semiconductor substrates Wafer guides for processing semiconductor substrates

2006-09-05

2006-09-05

Gravini, S. (Department: 3749)

Drying and gas or vapor contact with solids

Process

With nondrying treating of material

C134S902000

Reexamination Certificate

active

07100306

ABSTRACT:
A wafer guide includes a horizontal support panel and at least three vertical panels attached on one surface of the support panel. Each of the vertical panels has a vertical body panel and a plurality of protrusions upwardly extended from a top surface of the vertical body panel. Gap regions between the protrusions act as slots for holding wafers. Sidewalls of the slots have a convex shaped profile when viewed from a top view, and bottom surfaces of the slots also have a convex shaped profile when viewed from a cross sectional view that crosses the vertical panels.

REFERENCES:
patent: 5370142 (1994-12-01), Nishi et al.
patent: 6340405 (2002-01-01), Park
patent: 6889447 (2005-05-01), Lee et al.
patent: 6905570 (2005-06-01), Lim et al.
patent: 2004/0022607 (2004-02-01), Lim et al.

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