Wafer gripping fingers to minimize distortion

Details Wafer gripping fingers to minimize distortion Wafer gripping fingers to minimize distortion

2007-02-13

2007-02-13

Kramer, Dean J. (Department: 3652)

Handling: hand and hoist-line implements

Contact lens applicator

C294S902000, C414S941000

Reexamination Certificate

active

10876373

ABSTRACT:
An apparatus for measuring semiconductor wafer shape that minimizes wafer distortion. The apparatus includes a plurality of wafer gripping fingers for holding a wafer in a predetermined position during wafer measurement. Each finger includes a groove that contacts the edge of the wafer. The groove and the wafer edge have respective radii of curvature, in which the radius of curvature of the groove is greater than that of the wafer edge. Each finger includes a rigid member having a recess formed in a central location at one end thereof, and a compliant material such as PEEK disposed in the recess in which the groove is formed. The compliant material extends a first distance beyond the rigid member at the central groove location and a second shorter distance beyond the rigid member on each side of the central location. Because the groove areas on each side of the central area are more rigid than the central groove area, the fingers can hold the wafer with a high degree of accuracy while reducing wafer distortion.

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