Wafer gripping device

Handling: hand and hoist-line implements – Grapple – Well type

Patent

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Details

269233, 294 34, B25J 1500

Patent

active

044537573

ABSTRACT:
A wafer gripping device including a mechanism for automatically gripping a wafer by claws for transporting a wafer between an auxiliary vacuum chamber and a vacuum chamber of a semiconductor etching device. The claws for gripping a wafer have a vertical stroke increased when a wafer gripping operation is performed to enable the wafer to be gripped without any damage being caused thereto. The wafer gripping device includes a dust collection preventing member for minimizing dust collection.

REFERENCES:
patent: 167127 (1875-08-01), Sandbach
patent: 351871 (1886-11-01), Lampert

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