Wafer grinding machine

Details Wafer grinding machine Wafer grinding machine

1995-10-30

1997-10-21

Eley, Timothy V.

Abrading

Abrading process

Glass or stone abrading

451 41, 451 5, 451285, B24B 100, B24B 719, B24B 730

Patent

active

056790600

ABSTRACT:
The wafer grinding machine uses a centrally located robot to move a wafer from an input station to a measuring station. Thereafter, the wafer is moved into a grind station and a wash station sequentially. The robot is able to move a wafer from the wash station to either the measuring station for after-grinding measurements or directly to an output station. During grinding of one wafer, a second wafer may be held between the measuring station and the grind station while a ground wafer is moved from the wash station to the measuring station for after-grinding measurements.

REFERENCES:
patent: 4193226 (1980-03-01), Gill, Jr. et al.
patent: 4407262 (1983-10-01), Wirz et al.
patent: 4638601 (1987-01-01), Steere et al.
patent: 4653231 (1987-03-01), Cronkhite et al.
patent: 4680893 (1987-07-01), Cronkhite et al.
patent: 5036624 (1991-08-01), Steere, Jr.
patent: 5036628 (1991-08-01), Steere, III et al.
patent: 5076021 (1991-12-01), Steere, Jr.
patent: 5329732 (1994-07-01), Karlsrud et al.
patent: 5329733 (1994-07-01), Steere, Jr.
patent: 5333413 (1994-08-01), Hashimoto
patent: 5361545 (1994-11-01), Nakamura
patent: 5498199 (1996-03-01), Karlsrud et al.
patent: 5577950 (1996-11-01), Smith et al.
patent: 5605487 (1997-02-01), Hileman et al.
patent: 5616063 (1997-04-01), Okumura et al.

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