Wafer grinding apparatus

Details Wafer grinding apparatus Wafer grinding apparatus

2005-06-28

2005-06-28

Nguyen, Dung Van (Department: 3723)

Abrading

Machine

Combined

C451S444000, C451S388000

Reexamination Certificate

active

06910956

ABSTRACT:
A wafer grinding apparatus includes a wafer-transporting device for transporting a wafer, a first nozzle, and a second nozzle. The wafer-transporting device includes at least a suction pad having a first surface and a second surface that is flexible for sucking the wafer, and a transporting mechanism connected to the first surface of the suction pad for transporting the wafer. The first nozzle is used for ejecting a first liquid to the first surface of the suction pad for cleaning the first surface, and the second nozzle is used for ejecting a second liquid to the second surface of the suction pad and the wafer for cleaning the second surface and the wafer.

REFERENCES:
patent: 6126530 (2000-10-01), Hirata
patent: 6257966 (2001-07-01), Ishikawa et al.
patent: 6293855 (2001-09-01), Yoshida et al.
patent: 6319105 (2001-11-01), Togawa et al.
patent: 6752692 (2004-06-01), Wada et al.
patent: 11-285987 (1999-10-01), None
patent: 490359 (2002-06-01), None

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