Wafer grinder

Details Wafer grinder Wafer grinder

2005-11-22

2005-11-22

Morgan, Eileen P. (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

Computer controlled

C451S009000, C451S041000, C451S285000, C451S287000

Reexamination Certificate

active

06966817

ABSTRACT:
A wafer grinder withholds a lateral force and adjusts a tilt of worktable with precision. The wafer grinder is used to grind a wafer; that is, the tilt angle of wafer can be adjusted so that wafer is ground with precision. The wafer grinder has a housing module, a rotary worktable module, air pressure spindle module and an adjustment module.

REFERENCES:
patent: 5567199 (1996-10-01), Huber et al.
patent: 5816895 (1998-10-01), Honda
patent: 6206754 (2001-03-01), Moore
patent: 6472325 (2002-10-01), Hofmann et al.
patent: 6494769 (2002-12-01), Sinclair et al.

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