Wafer frame

Details Wafer frame Wafer frame

1999-02-08

2001-04-17

Saadat, Mahshid (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

Of specified material other than copper

C257S794000, C257S678000, C257S792000

Reexamination Certificate

active

06218727

ABSTRACT:

BACKGROUND OF THE INVENTION
FIELD OF THE INVENTION
The invention relates to a wafer frame for accommodating disk-shaped thin semiconductor wafers, which generally have a round structure. Such wafer frames, in which wafers have been fitted, are conveyed, for example, in a cassette one above the other in trays and are fed to appropriate treatment stations.
For example, photolithographic and etching structuring work is carried out on semiconductor wafers, to produce semiconductor chips. A multiplicity of semiconductor chips are present on a wafer. During the structuring work on the wafer, active regions on the wafer, which later form the individual chip, are spaced apart by a predetermined grid, so that zones or lines are produced along which the wafer can be cut. A process which is customarily used for that purpose is what is known as abrasive cutting using a high-speed diamond wheel.
In order to carry out that process, the wafer is held and guided in an accurate position using a vacuum device. For that purpose, a wafer frame is initially covered on the top side with a film. The wafer is placed with its unstructured side downward on the top of the film. That prevents mechanical damage to the individual chips which are present after the cutting. The vacuum device is applied to the film centrally from below through a central passage of the wafer frame, and the wafer or wafer and film are sucked on and locked in place. The cutting depth during the abrasive cutting is selected in such a way that the wafer is approximately or entirely cut through and the cutting depth penetrates slightly into the film.
The diameters of the wafers are being constantly increased in order to optimize the production processes as a whole. While previously the diameters were 4, 5 or 6 inches, nowadays wafers with a diameter of 8 inches are being used (1 inch=2.54 cm). Thus it is necessary to convey and treat wafers with a diameter of approximately 200 mm. Heretofore, in microelectronics mounting technology a metal wafer frame has been used to fix and handle such wafers.
SUMMARY OF THE INVENTION
It is accordingly an object of the invention to provide a wafer frame, which overcomes the hereinafore-mentioned disadvantages of the heretofore-known devices of this general type and which considerably facilitates handling while satisfying the same quality requirements with regard to moisture uptake, flexural strength and heat resistance.
With the foregoing and other objects in view there is provided, in accordance with the invention, a wafer frame for accommodating and conveying semiconductor wafers in microelectronics mounting technology, comprising a plate-like base body formed of a plastic with a glass fiber content of from 1 to 40% by weight, the base body having a central circular passage formed therein for accommodating a film and a wafer placed on the film.
The invention is based on the recognition that a suitable plastic is able to achieve improved materials properties if a certain glass fiber content is added. This may, for example, have a beneficial effect on the modulus of elasticity, the flexural strength and the heat resistance.
The requirements are, for example, as follows:
heat resistance: ≧120° C. according to Martens, Vicat
moisture uptake: ≦0.8% in accordance with American standard at 23° C.
flexural strength: ≧120 Mpa (measured at 23° C.)
flexural modulus of elasticity: 10,000-18,000 N/mm
2
(measured at 23° C.)
If a plastic wafer frame is used, the result is a weight saving of 48 to 58% as compared to a metal wafer frame. The plastic wafer frame satisfies the technical requirements since a glass fiber content is added to the mixture. Glass fiber content is intended to mean a pulverulent substance including small pieces or rods of glass fiber.
In accordance with another feature of the invention, the plastic is a polyphenylene sulfone (PPS), a polyether sulfone (PES) or a polyether ether ketone (PEEK).
In accordance with a further feature of the invention, the glass fiber content lies in a range from 20 to 40% by weight.
In accordance with a concomitant feature of the invention, the plastic is a liquid crystal polymer (LCP) and the glass fiber content may lie in a range from 1 to 20% by weight.
Other features which are considered as characteristic for the invention are set forth in the appended claims.
Although the invention is illustrated and described herein as embodied in a wafer frame, it is nevertheless not intended to be limited to the details shown, since various modifications and structural changes may be made therein without departing from the spirit of the invention and within the scope and range of equivalents of the claims.
The construction and method of operation of the invention, however, together with additional objects and advantages thereof will be best understood from the following description of specific embodiments when read in connection with the accompanying drawings.


REFERENCES:
patent: 4680617 (1987-07-01), Ross
patent: 4-04145638 (1992-05-01), None

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