Wafer for use in selective connecting and disconnecting of plast

Details Wafer for use in selective connecting and disconnecting of plast Wafer for use in selective connecting and disconnecting of plast

1997-07-10

1999-02-16

Sells, James

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

Means joining flexible indefinite length or endless bodies...

156158, 1563042, 1563046, 156499, B32B 3100

Patent

active

058716122

ABSTRACT:
A wafer for use in the selective connecting and disconnecting of plastic tubes incorporates a fuse in an aperture. The fuse is made of a laminate having light transmission characteristics which change after the wafer and its laminate have been heated. The wafer would be used in a device for connecting/disconnecting plastic tubes wherein the device includes a sensor which would deactivate the device if the sensor detects the change in light transmission characteristics thereby indicating that the wafer had been previously used.

REFERENCES:
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patent: 5156701 (1992-10-01), Spencer et al.
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patent: 5279685 (1994-01-01), Ivansons et al.
patent: 5397425 (1995-03-01), Ivansons et al.
patent: 5525186 (1996-06-01), Ivansons et al.
patent: 5632852 (1997-05-01), Ivansons et al.

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