Semiconductor device manufacturing: process – Chemical etching – Liquid phase etching
Reexamination Certificate
2011-05-31
2011-05-31
Ghyka, Alexander G (Department: 2812)
Semiconductor device manufacturing: process
Chemical etching
Liquid phase etching
C438S758000, C118S503000, C205S157000, C205S640000, C257SE21219
Reexamination Certificate
active
07951724
ABSTRACT:
The present invention is a wafer fixture comprising a housing body, a thrust plate, a flexure clamp, gaskets, flexure pins on an inner circumference of the housing body, locking grooves on an outer circumference of the flexure clamp, and a handle. A wafer may be placed between the gaskets of the housing body and the thrust plate. The flexure clamp may be placed over the thrust plate and secured to the housing body by rotating the flexure clamp such that locking grooves of the fixture plate mate with the flexure pins on the inner circumference of the housing body. The present invention in yet another embodiment is a wafer etch tool comprising a housing, a flexure clamp, and means for securing a wafer between the housing and the flexure clamp upon rotation of the flexure clamp within the housing.
REFERENCES:
patent: 7169280 (2007-01-01), Klocke et al.
patent: 7210991 (2007-05-01), Van Der Veen et al.
“AMMT Products, Electroplating—Wafer Holder Single EC with Electrical Contacts”; downloaded product specification on Jul. 15, 2008 from http://www.ammt.com/content/products/electroplating/index.html.
Dugas Matthew P.
Fyten Steve
Marchetti John J.
Advanced Research Corporation
Dorsey & Whitney LLP
Ghyka Alexander G
Witzany, Esq. Nathan J.
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