Package making – Methods – Enclosing contents within progressively formed web means
Reexamination Certificate
2007-07-17
2007-07-17
Gerrity, Stephen F. (Department: 3721)
Package making
Methods
Enclosing contents within progressively formed web means
C053S411000, C053S131100, C053S553000
Reexamination Certificate
active
10565579
ABSTRACT:
The invention relates to a method for individually packing sheet or film-type materials in an automatic manner, said materials consisting of at least one material layer, in a packing unit with marked contents. A marking (40) made of a waxy marking material is applied to a warmed first packing material strip (20). The sheet or film-type material (10) is fixed to the marking wit surface thereof, whereby the roughness of the surface thereof is greater than the roughness of the surface of the first packing material strip. A second packing material strip (30) is applied to the sheet or film-type material and is connected to the first packing material strip in order to form a closed packing unit. The packing unit (35) is cooled and the marking is separated from the first packing material strip. A secure packing method and a marking for sheet or film-type materials are developed according to said inventive method.
REFERENCES:
patent: RE21065 (1939-05-01), Copeman
patent: 2737764 (1956-03-01), Clyde
patent: 2895270 (1959-07-01), Blaess
patent: 3496910 (1970-02-01), Nugarus
patent: 3575755 (1971-04-01), Cutler et al.
patent: 3733768 (1973-05-01), Carls et al.
patent: 6165499 (2000-12-01), Kleinsorgen et al.
patent: 6182420 (2001-02-01), Berman et al.
patent: 6467621 (2002-10-01), Ishida
patent: 2317491 (1999-01-01), None
patent: 101 44 287 (2003-04-01), None
patent: WO 99/35051 (1999-07-01), None
patent: WO 2064123 (2002-08-01), None
Gerrity Stephen F.
LTS Lohmann Therapie-Systeme AG
LandOfFree
Wafer fixing and marking does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Wafer fixing and marking, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wafer fixing and marking will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3763893