Metal working – Method of mechanical manufacture – Electrical device making
Patent
1998-10-30
2000-11-14
Young, Lee
Metal working
Method of mechanical manufacture
Electrical device making
29 2541, 29 2535, 310322, 310324, H04R 3100, H04R 1700
Patent
active
06145186&
ABSTRACT:
A method of producing a capacitive electroacoustic transducer comprising the initial step forming a substrate having top and bottom surfaces each having a periphery thereof. A first electrode of the transducer is formed upon a portion of the top surface of the substrate. A diaphragm mounting ring of a conductive material is disposed about the periphery of the top surface and separated from the first electrode, and is sized to be thicker than the first electrode by a desired electrode separation distance. The diaphragm mounting ring is characterized by physical dimensions thereof. A compensation ring is aligned with the diaphragm mounting ring upon the bottom surface, and is formed of the same conductive material as the diaphragm mounting ring. The compensation ring is sized to have the same physical dimensions as the diaphragm mounting ring. A diaphragm constituting a conductive second electrode of the transducer is formed and attached to the diaphragm mounting ring to separate the first and second electrodes in electrical and physical spaced relationship so as to constitute a capacitive relationship therebetween, such that an electric field formed between the first and second electrodes varies in relationship with deflections of the second electrode to permit conversion between electrical and acoustic signals.
REFERENCES:
patent: 3405559 (1968-10-01), Moffatt
patent: 3775572 (1973-11-01), Ishibashi et al.
patent: 3775839 (1973-12-01), Talmo et al.
patent: 3942029 (1976-03-01), Kawakami et al.
patent: 3963881 (1976-06-01), Fraim et al.
patent: 3991285 (1976-11-01), Van Den Worm et al.
patent: 4225755 (1980-09-01), Block
patent: 4249043 (1981-02-01), Morgan et al.
patent: 4389895 (1983-06-01), Rud, Jr.
patent: 4491697 (1985-01-01), Tanaka et al.
patent: 4558184 (1985-12-01), Busch-Vishniac et al.
patent: 4866683 (1989-09-01), Phillips
patent: 4872945 (1989-10-01), Myers et al.
patent: 5001595 (1991-03-01), Dittrich et al.
patent: 5038459 (1991-08-01), Yasuda et al.
patent: 5050035 (1991-09-01), Hegner et al.
patent: 5101543 (1992-04-01), Cote et al.
patent: 5272758 (1993-12-01), Isogami et al.
patent: 5452268 (1995-09-01), Bernstein
patent: 5623102 (1997-04-01), Arndt et al.
Anderson Terry J.
Hoch Jr. Karl J.
Northrop Grumman Corporation
Tugbang A. Dexter
Young Lee
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