Wafer fabricated electroacoustic transducer

Electrical audio signal processing systems and devices – Electro-acoustic audio transducer – Microphone capsule only

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381191, H04R 2500

Patent

active

058548467

ABSTRACT:
A capacitive electroacoustic transducer which includes an electrically insulative substrate, a layer of conductive material disposed on a portion of a top surface of the substrate forming a first electrode of the transducer, a conductive diaphragm forming a second electrode of the transducer which is deflectable in relation to the first electrode, and a structure for electrically and physically separating the first and second electrodes in spaced relationship so as to constitute a capacitor. This transducer exhibits a high degree of thermal stability partly due to the substrate and diaphragm being made of materials having closely matched thermal expansion coefficients. This feature ensures that the tension in the diaphragm stays consistent even with varying temperatures, thereby maintaining a constant transducer sensitivity. In addition, the distance separating the first and second electrodes is minimized so as to create a short thermal expansion path. This short path length minimizing changes in the response of the transducer due to variations in temperature. This transducer can also be batch produced.

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