Wafer exposure method and apparatus

Details Wafer exposure method and apparatus Wafer exposure method and apparatus

1982-09-22

1985-02-19

Kittle, John E.

Radiation imagery chemistry: process, composition, or product th

Including control feature responsive to a test or measurement

430327, 430394, 356357, 356444, G03C 500, G01B 1102

Patent

active

045006156

ABSTRACT:
Provided are a wafer exposure method and apparatus wherein a mask of a desired chip pattern is exposed in a reduced scale onto a wafer coated with a resist film, and a number of resist patterns are transferred onto the resist film by the step and repeat method. During the transfer of the resist pattern, the thickness of the resist film is measured, and the exposure is controlled according to the measured thickness of the resist film.

REFERENCES:
patent: 3950170 (1976-04-01), Grosholz
patent: 4083634 (1978-04-01), Momose et al.
patent: 4308586 (1981-12-01), Coates
patent: 4388389 (1983-06-01), Gold

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