Wafer expanding device, component feeder, and expanding...

Details Wafer expanding device, component feeder, and expanding... Wafer expanding device, component feeder, and expanding...

2005-05-19

2009-06-30

Arbes, C. J (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S832000, C029S840000, C438S113000, C438S114000

Reexamination Certificate

active

07552528

ABSTRACT:
In slack removal processing for removing slack generated on a wafer sheet by heating blow, a wafer feeding plate is positioned at a height position between a first height position and a second height position. This makes it possible to decrease a gap between an upper end portion of an expanding ring and a lower face of the wafer sheet and allows efficient and uniform processing. Moreover, setting the height position so as to avoid the contact between the wafer sheet and the upper end portion of the expanding ring at least when the slack removal processing is completed reliably prevents shrinking operation of the wafer sheet from being disturbed by the contact between the wafer sheet and the upper end portion.

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patent: 2005-109043 (2005-04-01), None

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