Wafer etching apparatus

Details Wafer etching apparatus Wafer etching apparatus

1991-10-16

1993-05-18

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

156639, 156662, H01L 21306, B44C 122

Patent

active

052117944

ABSTRACT:
A wafer etching apparatus for etching wafers provided with an orientation flat, composed of a casing, at least five horizontal, parallel and rotative rollers having annular engagement grooves arranged at regular intervals in the axial direction to receive and support wafers vertically, and a press rod means, wherein the rotative rollers are arranged such that the rollers cooperate to circumscribe the wafers, and that when the orientation flat faces any one of the rollers the rest of the rollers cooperate to hold the wafer so as to prevent the orientation flat from coming in contact with the facing roller.

REFERENCES:
patent: 3964957 (1976-06-01), Walsh
patent: 4388140 (1983-06-01), Nakazato et al.

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