Wafer edge inspection data gathering

Details Wafer edge inspection data gathering Wafer edge inspection data gathering

2006-03-14

2006-03-14

Bui, Bryan (Department: 2863)

Data processing: measuring, calibrating, or testing

Measurement system in a specific environment

Chemical analysis

C702S035000, C702S036000, C438S012000, C438S014000

Reexamination Certificate

active

07013222

ABSTRACT:
A wafer edge inspection method and apparatus include a review tool that captures images of the semiconductor wafer. According to various embodiments, the present invention also includes a map of points of interest proximate to the edge of the wafer, automatic image capturing at the points of interest, fake defect locations defining the points of interest, a database in which the images are stored and computer-searchable for detailed defect analysis, a software tool for controlling the method and apparatus and/or context information identifying the points of interest, the inspected wafer and/or the fabrication station/step preceding the inspection.

REFERENCES:
patent: 6062084 (2000-05-01), Chang et al.
patent: 6545752 (2003-04-01), Swan et al.
patent: 6566673 (2003-05-01), Swan et al.
patent: 6799130 (2004-09-01), Okabe et al.
patent: 2002/0111038 (2002-08-01), Matsumoto et al.

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